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Freescale Semiconductor Technical Data
MPX2300DT1 Rev. 6, 10/2004
High Volume Pressure Sensor For Disposable Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration. NOTE: Freescale Semiconductor is also offering the Chip Pak package in application--specific configurations, which will have an "SPX" prefix, followed by a four--digit number, unique to the specific customer. Features * Low Cost * Integrated Temperature Compensation and Calibration * Ratiometric to Supply Voltage * Polysulfone Case Material (Medical, Class V Approved) * Provided in Easy--to--Use Tape and Reel Application Examples * Medical Diagnostics * Infusion Pumps * Blood Pressure Monitors * Pressure Catheter Applications * Patient Monitoring NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. Freescale Semiconductor 's MPX2300DT1/ MPX2301DT1 Pressure Sensors have been designed for medical usage by combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP.
MPX2300DT1 MPX2301DT1
Freescale Semiconductor Preferred Device
PRESSURE SENSORS 0 to 300 mmHg (0 to 40 kPa)
CHIP PAK PACKAGE
MPX2300/1DT1 CASE 423A
PIN NUMBER
1 2 VS S+ 3 4 S-Gnd
A silicone dielectric gel covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. The MPX2301DT1 is a reduced gel option.
Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
Sensor Device Data Freescale Semiconductor
1
MAXIMUM RATINGS(NOTE)
Rating Maximum Pressure (Backside) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 125 --25 to +85 +15 to +40 Unit PSI C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 6 Vdc, TA = 25C unless otherwise noted)
Characteristics Pressure Range Supply Voltage(7) Symbol POP VS Io Voff -- VFSS -- -- -- TCS TCVFSS TCVoff Zin Zout RCAL tR -- -- Min 0 -- -- --0.75 4.95 2.976 -- 1.5 -- 1.5 -- 3.0 --0.1 --0.1 --9.0 1800 270 97 -- 0 -- Typ -- 6.0 1.0 -- 5.0 3.006 -- -- -- -- -- -- -- -- 100 1.0 -- 0.5 Max 300 10 -- 0.75 5.05 3.036 1.5 1.5 3.0 +0.1 +0.1 +9.0 4500 330 103 -- 85 -- Unit mmHg Vdc mAdc mV V/V/mmHg mV %VFSS % % %/C %/C V/C mmHg ms C %VFSS
Supply Current Zero Pressure Offset Sensitivity Full Scale Span(1) Linearity + Hysteresis(2) Accuracy(9) Accuracy(9) VS = 6 V, P = 101 to 200 mmHg VS = 6 V, P = 201 to 300 mmHg
Temperature Effect on Sensitivity Temperature Effect on Full Scale Span(3) Temperature Effect on Offset(4) Input Impedance Output Impedance RCAL (150 k)(8) Time(5)
Response (10% to 90%)
Temperature Error Band Stability(6)
NOTES: 1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 2. Maximum deviation from end--point straight line fit at 0 and 200 mmHg. 3. Slope of end--point straight line fit to full scale span at 15C and +40C relative to +25C. 4. Slope of end--point straight line fit to zero pressure offset at 15C and +40C relative to +25C. 5. For a 0 to 300 mmHg pressure step change. 6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10C to +85C after: a. 1000 temperature cycles, --40C to +125C. b. 1.5 million pressure cycles, 0 to 300 mmHg. 7. Recommended voltage supply: 6 V 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may induce additional error due to device self--heating. 8. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to VS and S+ output. 9. Accuracy is calculated using the following equation: Errorp = {[Vp -- Offset)/(SensNom*VEX)]--P}/P Where: Vp = Actual output voltage at pressure P in microvolts (V) Offset = Voltage output at P = 0mmHg in microvolts (V) SensNom = Nominal sensitivity = 5.01 V/V/mmHg VEX = Excitation voltage P = Pressure applied to the device
MPX2300DT1 MPX2301DT1 2 Sensor Device Data Freescale Semiconductor
ORDERING INFORMATION The MPX2300DT1/MPX2301DT1 silicon pressure sensors are available in tape and reel packaging.
Device Type/Order No. MPX2300DT1 MPX2301DT1 Packaging Information Tape and Reel Case No. 423A 423A Reel Size 330 mm Device Description Chip Pak, Full Gel Chip Pak, 1/3 Gel Tape Width 24 mm Marking Date Code, Lot ID Date Code, Lot ID Quantity 1000 pc/reel
PACKAGE DIMENSIONS
A M C L N V K DETAIL A D1 G H FRONT VIEW E END VIEW AC F AA AB
NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 VCC +OUT --OUT GROUND MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92
F B
1
23
4
--TJ
AD D2 DETAIL A BACK VIEW
DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD
CASE 423A-03 ISSUE C
STYLE 1: PIN 1. 2. 3. 4.
MPX2300DT1 MPX2301DT1 Sensor Device Data Freescale Semiconductor 3
How to Reach Us:
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MPX2300DT1 Rev. 6 10/2004
MPX2300DT1 MPX2301DT1 4 Sensor Device Data Freescale Semiconductor

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